Simscape analysis and modeling of a Technology Cooling Loop (TCL) system for Data Center liquid cooling

The exponential growth of Artificial Intelligence and high-performance computing has led to a significant increase in rack power density, reaching levels where traditional air cooling is no longer sufficient. This shift requires the implementation of advanced liquid cooling solutions to manage the extreme heat flux concentrated on modern processors. This thesis presents the design, development and analysis of a high-fidelity Digital Twin for a Technology Cooling Loop of a hyperscale data center facility, integrating 16 high-density GPU racks with a peak thermal load exceeding 1.8 MW, served by 4 Coolant Distribution Units. The model is developed in Simscape (MATLAB), utilizing the Thermal Liquid domain to simulate the simultaneous evolution of hydraulic and thermal dynamics along the TCL. To ensure predictive accuracy, the model was tuned and validated using real data recorded during standardized Heat Load Tests performed during the commissioning phase. The research concludes with a performance comparison between different architectural layouts, evaluating efficiency and pressure drop distribution across alternative piping configurations. Further analyses were conducted to assess system resilience during maintenance scenarios, rapid leakage containment maneuvers, and variable AI computational workloads, providing a strategic tool for the optimization of operational expenditure and the assurance of thermal stability in mission-critical infrastructures.