With the advent of Solid State Lighting, lighting enters a new domain with process that is unknown. An example is the tilting phenomenon which affects all electronic assemblies and thus also LED-based PCB assemblies, but its impact in lighting is still not fully understood. This thesis focuses on the study of tilting phenomenon and, especially, its impact in terms of optical and reliability performances

Solder-Joint Tilting on LED-based PCB Assemblies

Li, Xiaolong
2015/2016

Abstract

With the advent of Solid State Lighting, lighting enters a new domain with process that is unknown. An example is the tilting phenomenon which affects all electronic assemblies and thus also LED-based PCB assemblies, but its impact in lighting is still not fully understood. This thesis focuses on the study of tilting phenomenon and, especially, its impact in terms of optical and reliability performances
2015-04-21
tilting, LED, printed circuit, solder joint
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.12608/19580