Development and characterization of copper-based inks for printed electronics: investigation of the role of three amine ligands

Conductive inks have gathered increasing attention in the fabrication of next-generation electronic devices because of their prominent compatibility and producibility. Copper has the characteristics to replace silver in commercially available conductive inks: very similar electrical, thermal and mechanical properties with the advantage of an extremely lower price. In this thesis project three different amine ligands are investigated to develop three different copper-amine complex inks. The developed conductive inks are used to print conductive traces on polymeric flexible substrates. The electrical resistivity of the conductive traces are measured in the order of magnitude of 10^-6 Ω·m. FTIR measurements are carried out to understand chemical structure of complexed inks. DSC and TGA curves of the three inks are analysed to understand the reaction mechanisms during curing process, and the effects of amines on the decomposition reaction temperature. SEM analyses of cured inks are used to understand the effect of heat treatment parameters on nucleation and growth of in-situ nanoparticles. Kissinger and Ozawa method are used to obtain kinetic parameter for decomposition reaction.