The climatic reliability of electronic circuits has become a relevant issue for the electronic industry. Due to factor like miniaturization, the electric field applied on the system and contamination, the corrosion and climatic effects related failures in electronics have become topics of intense research. The spread of electronic products and their complexity has dramatically increased, and they surround everyday life, as well as advanced applications and products. The propensity of electronic devices to fail is greatly dependent on the environmental conditions wherein they are operating and the type and levels of contamination present. The process related solder flux residues is an issue of great concern due to their hygroscopic behavior which attracts humidity creating a conductive moisture layer on the PCB surface. No-clean flux types are commonly employed as their residues should totally decompose during soldering requiring no post-cleaning processes
Role of supply chain logistics and manufacturing process on the reliability of electronic devices
Rizzo, Riccardo
2012/2013
Abstract
The climatic reliability of electronic circuits has become a relevant issue for the electronic industry. Due to factor like miniaturization, the electric field applied on the system and contamination, the corrosion and climatic effects related failures in electronics have become topics of intense research. The spread of electronic products and their complexity has dramatically increased, and they surround everyday life, as well as advanced applications and products. The propensity of electronic devices to fail is greatly dependent on the environmental conditions wherein they are operating and the type and levels of contamination present. The process related solder flux residues is an issue of great concern due to their hygroscopic behavior which attracts humidity creating a conductive moisture layer on the PCB surface. No-clean flux types are commonly employed as their residues should totally decompose during soldering requiring no post-cleaning processesFile | Dimensione | Formato | |
---|---|---|---|
Final[1]TESI_RR.pdf
accesso aperto
Dimensione
18.29 MB
Formato
Adobe PDF
|
18.29 MB | Adobe PDF | Visualizza/Apri |
The text of this website © Università degli studi di Padova. Full Text are published under a non-exclusive license. Metadata are under a CC0 License
https://hdl.handle.net/20.500.12608/16377